Last month we told you that Asus is all set to launch its Zenfone 5 series of smartphones later this month at MWC 2018 in Barcelona. Asus confirmed its MWC 2018 presence with the #BACKTO5 hashtag, hinting at Asus Zenfone 5 series launched. We have already told you about the Asus Zenfone 5 Max and Asus Zenfone 5 Lite.
Now according to newly leaked renders, we have some important details. Asus Zenfone 5 will sport an 18:9 aspect ratio but as you can see in the image, it will have thick bezels. The smartphone will come with a unibody metal design and the antenna bands are present at the top and bottom edges.
The smartphone will have a vertical dual rear camera setup just like we have seen on the iPhone X. Asus Zenfone 5 will have a circular rear placed fingerprint scanner just above the Asus logo. It will use a MicroUSB port for charging and data syncing and will come with a 3.5 mm headphone jack.
Asus Zenfone 5 is expected to run on Qualcomm Snapdragon 43o octa-core processor coupled with 3GB of RAM. It will come with Android Oreo 8.0 out of the box. We hope the bezels are thinner in real. Stay tuned to Sid Tech for all the latest tech updates from the MWC 2018.